Processing-Structure-Protrusion Relationship of 3-D Cu TSVs: Control at the Atomic Scale

A phase-field-crystal model is used to investigate the processing-structure-protrusion relationship of blind Cu through-silicon vias (TSVs) at the atomic scale. A higher temperature results in a larger TSV protrusion. Deformation via dislocation motion dominates at temperatures lower than around 300...

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Autores principales: Jinxin Liu, Zhiheng Huang, Paul P. Conway, Yang Liu
Formato: article
Lenguaje:EN
Publicado: IEEE 2019
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Acceso en línea:https://doaj.org/article/e9f3d9c867ef430c93bc5047a31fc0f9
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