Size-Dependent Switching Properties of Spin-Orbit Torque MRAM With Manufacturing-Friendly 8-Inch Wafer-Level Uniformity

We have developed a manufacturing-friendly spin-orbit torque magnetic random access memory (SOT-MRAM) technology in CMOS compatible 8-inch fab process. The proposed SOT-MRAM process technology resolves etching non-uniformity and reduction of high resistivity heavy-metal nanowire resistance issues. B...

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Autores principales: Sk Ziaur Rahaman, I-Jung Wang, Ding-Yeong Wang, Chi-Feng Pai, Yu-Chen Hsin, Shan-Yi Yang, Hsin-Han Lee, Yao-Jen Chang, Yi-Ching Kuo, Yi-Hui Su, Guan-Long Chen, Fang-Ming Chen, Jeng-Hua Wei, Tuo-Hung Hou, Shyh-Shyuan Sheu, Chih-I Wu, Duan-Lee Deng
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Publicado: IEEE 2020
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spelling oai:doaj.org-article:f0f3a62054ee4f20ac4fdbc9293e02212021-11-19T00:01:13ZSize-Dependent Switching Properties of Spin-Orbit Torque MRAM With Manufacturing-Friendly 8-Inch Wafer-Level Uniformity2168-673410.1109/JEDS.2020.2971892https://doaj.org/article/f0f3a62054ee4f20ac4fdbc9293e02212020-01-01T00:00:00Zhttps://ieeexplore.ieee.org/document/8984374/https://doaj.org/toc/2168-6734We have developed a manufacturing-friendly spin-orbit torque magnetic random access memory (SOT-MRAM) technology in CMOS compatible 8-inch fab process. The proposed SOT-MRAM process technology resolves etching non-uniformity and reduction of high resistivity heavy-metal nanowire resistance issues. Besides, we present device size-dependent switching current threshold in the proposed SOT-MRAM cell structure. To realize the potential of our fabricated SOT-MRAM, wafer-level uniformity, cycling and temperature dependence SOT switching have been comprehensively investigated. Furthermore, the thermal stability factor (<inline-formula> <tex-math notation="LaTeX">${\Delta }$ </tex-math></inline-formula>) was calculated from temperature-dependence SOT switching to fulfill the thermal stability criteria, i.e., &#x003E; 10 years of this emerging SOT-MRAM technology.Sk Ziaur RahamanI-Jung WangDing-Yeong WangChi-Feng PaiYu-Chen HsinShan-Yi YangHsin-Han LeeYao-Jen ChangYi-Ching KuoYi-Hui SuGuan-Long ChenFang-Ming ChenJeng-Hua WeiTuo-Hung HouShyh-Shyuan SheuChih-I WuDuan-Lee DengIEEEarticleSpintronicsspin-orbit torquespin-transfer torquespin-hall effectmagnetic tunnel junctionElectrical engineering. Electronics. Nuclear engineeringTK1-9971ENIEEE Journal of the Electron Devices Society, Vol 8, Pp 163-169 (2020)
institution DOAJ
collection DOAJ
language EN
topic Spintronics
spin-orbit torque
spin-transfer torque
spin-hall effect
magnetic tunnel junction
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
spellingShingle Spintronics
spin-orbit torque
spin-transfer torque
spin-hall effect
magnetic tunnel junction
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
Sk Ziaur Rahaman
I-Jung Wang
Ding-Yeong Wang
Chi-Feng Pai
Yu-Chen Hsin
Shan-Yi Yang
Hsin-Han Lee
Yao-Jen Chang
Yi-Ching Kuo
Yi-Hui Su
Guan-Long Chen
Fang-Ming Chen
Jeng-Hua Wei
Tuo-Hung Hou
Shyh-Shyuan Sheu
Chih-I Wu
Duan-Lee Deng
Size-Dependent Switching Properties of Spin-Orbit Torque MRAM With Manufacturing-Friendly 8-Inch Wafer-Level Uniformity
description We have developed a manufacturing-friendly spin-orbit torque magnetic random access memory (SOT-MRAM) technology in CMOS compatible 8-inch fab process. The proposed SOT-MRAM process technology resolves etching non-uniformity and reduction of high resistivity heavy-metal nanowire resistance issues. Besides, we present device size-dependent switching current threshold in the proposed SOT-MRAM cell structure. To realize the potential of our fabricated SOT-MRAM, wafer-level uniformity, cycling and temperature dependence SOT switching have been comprehensively investigated. Furthermore, the thermal stability factor (<inline-formula> <tex-math notation="LaTeX">${\Delta }$ </tex-math></inline-formula>) was calculated from temperature-dependence SOT switching to fulfill the thermal stability criteria, i.e., &#x003E; 10 years of this emerging SOT-MRAM technology.
format article
author Sk Ziaur Rahaman
I-Jung Wang
Ding-Yeong Wang
Chi-Feng Pai
Yu-Chen Hsin
Shan-Yi Yang
Hsin-Han Lee
Yao-Jen Chang
Yi-Ching Kuo
Yi-Hui Su
Guan-Long Chen
Fang-Ming Chen
Jeng-Hua Wei
Tuo-Hung Hou
Shyh-Shyuan Sheu
Chih-I Wu
Duan-Lee Deng
author_facet Sk Ziaur Rahaman
I-Jung Wang
Ding-Yeong Wang
Chi-Feng Pai
Yu-Chen Hsin
Shan-Yi Yang
Hsin-Han Lee
Yao-Jen Chang
Yi-Ching Kuo
Yi-Hui Su
Guan-Long Chen
Fang-Ming Chen
Jeng-Hua Wei
Tuo-Hung Hou
Shyh-Shyuan Sheu
Chih-I Wu
Duan-Lee Deng
author_sort Sk Ziaur Rahaman
title Size-Dependent Switching Properties of Spin-Orbit Torque MRAM With Manufacturing-Friendly 8-Inch Wafer-Level Uniformity
title_short Size-Dependent Switching Properties of Spin-Orbit Torque MRAM With Manufacturing-Friendly 8-Inch Wafer-Level Uniformity
title_full Size-Dependent Switching Properties of Spin-Orbit Torque MRAM With Manufacturing-Friendly 8-Inch Wafer-Level Uniformity
title_fullStr Size-Dependent Switching Properties of Spin-Orbit Torque MRAM With Manufacturing-Friendly 8-Inch Wafer-Level Uniformity
title_full_unstemmed Size-Dependent Switching Properties of Spin-Orbit Torque MRAM With Manufacturing-Friendly 8-Inch Wafer-Level Uniformity
title_sort size-dependent switching properties of spin-orbit torque mram with manufacturing-friendly 8-inch wafer-level uniformity
publisher IEEE
publishDate 2020
url https://doaj.org/article/f0f3a62054ee4f20ac4fdbc9293e0221
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