Bending reliability of screen-printed vias for a flexible energy module

Abstract The future of printed electronics involves advancements not only related to full system integration, but also lean process manufacturing. A critical aspect of this progress is developed in this study, which evaluates a highly flexible screen printed through-hole-via using silver micropartic...

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Autores principales: Manu Kujala, Terho Kololuoma, Jari Keskinen, Donald Lupo, Matti Mäntysalo, Thomas M. Kraft
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2020
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Acceso en línea:https://doaj.org/article/f7e11fb0e6304dd09a921b515336f25c
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