Bending reliability of screen-printed vias for a flexible energy module

Abstract The future of printed electronics involves advancements not only related to full system integration, but also lean process manufacturing. A critical aspect of this progress is developed in this study, which evaluates a highly flexible screen printed through-hole-via using silver micropartic...

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Autores principales:	Manu Kujala, Terho Kololuoma, Jari Keskinen, Donald Lupo, Matti Mäntysalo, Thomas M. Kraft
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2020
Materias:	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492
Acceso en línea:	https://doaj.org/article/f7e11fb0e6304dd09a921b515336f25c
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spelling	oai:doaj.org-article:f7e11fb0e6304dd09a921b515336f25c2021-12-02T15:16:00ZBending reliability of screen-printed vias for a flexible energy module10.1038/s41528-020-00087-42397-4621https://doaj.org/article/f7e11fb0e6304dd09a921b515336f25c2020-09-01T00:00:00Zhttps://doi.org/10.1038/s41528-020-00087-4https://doaj.org/toc/2397-4621Abstract The future of printed electronics involves advancements not only related to full system integration, but also lean process manufacturing. A critical aspect of this progress is developed in this study, which evaluates a highly flexible screen printed through-hole-via using silver microparticle inks, for applications in energy harvesting and storage modules. The printed vias’ fabrication and durability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, through 125-µm-thick PET foil, were laser cut (nominally 50, 100, 150, and 200 µm diameters) then filled, and simultaneously connected to adjacent vias by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor containing aqueous electrolyte and carbon electrodes. The results indicate that the lower viscosity silver ink (DuPont 5064H) fills the via less effectively than the higher viscosity ink (Asahi LS411AW), and as the via size increases (≥150 µm diameter) via walls are coated rather than filled. Conversely, the more viscous ink fills the via thoroughly and exhibited a 100% yield (1010 vias; 100 µm nominal via diameter) with the two-step direct screen-printing method. The 10-mm radius bending test showed no signs of via specific breakdown after 30,000 cycles. The results indicate that this via filling process is likely roll-to-roll compatible to enable multi-layered printed electronic devices.Manu KujalaTerho KololuomaJari KeskinenDonald LupoMatti MäntysaloThomas M. KraftNature PortfolioarticleElectronicsTK7800-8360Materials of engineering and construction. Mechanics of materialsTA401-492ENnpj Flexible Electronics, Vol 4, Iss 1, Pp 1-8 (2020)
institution	DOAJ
collection	DOAJ
language	EN
topic	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492
spellingShingle	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492 Manu Kujala Terho Kololuoma Jari Keskinen Donald Lupo Matti Mäntysalo Thomas M. Kraft Bending reliability of screen-printed vias for a flexible energy module
description	Abstract The future of printed electronics involves advancements not only related to full system integration, but also lean process manufacturing. A critical aspect of this progress is developed in this study, which evaluates a highly flexible screen printed through-hole-via using silver microparticle inks, for applications in energy harvesting and storage modules. The printed vias’ fabrication and durability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, through 125-µm-thick PET foil, were laser cut (nominally 50, 100, 150, and 200 µm diameters) then filled, and simultaneously connected to adjacent vias by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor containing aqueous electrolyte and carbon electrodes. The results indicate that the lower viscosity silver ink (DuPont 5064H) fills the via less effectively than the higher viscosity ink (Asahi LS411AW), and as the via size increases (≥150 µm diameter) via walls are coated rather than filled. Conversely, the more viscous ink fills the via thoroughly and exhibited a 100% yield (1010 vias; 100 µm nominal via diameter) with the two-step direct screen-printing method. The 10-mm radius bending test showed no signs of via specific breakdown after 30,000 cycles. The results indicate that this via filling process is likely roll-to-roll compatible to enable multi-layered printed electronic devices.
format	article
author	Manu Kujala Terho Kololuoma Jari Keskinen Donald Lupo Matti Mäntysalo Thomas M. Kraft
author_facet	Manu Kujala Terho Kololuoma Jari Keskinen Donald Lupo Matti Mäntysalo Thomas M. Kraft
author_sort	Manu Kujala
title	Bending reliability of screen-printed vias for a flexible energy module
title_short	Bending reliability of screen-printed vias for a flexible energy module
title_full	Bending reliability of screen-printed vias for a flexible energy module
title_fullStr	Bending reliability of screen-printed vias for a flexible energy module
title_full_unstemmed	Bending reliability of screen-printed vias for a flexible energy module
title_sort	bending reliability of screen-printed vias for a flexible energy module
publisher	Nature Portfolio
publishDate	2020
url	https://doaj.org/article/f7e11fb0e6304dd09a921b515336f25c
work_keys_str_mv	AT manukujala bendingreliabilityofscreenprintedviasforaflexibleenergymodule AT terhokololuoma bendingreliabilityofscreenprintedviasforaflexibleenergymodule AT jarikeskinen bendingreliabilityofscreenprintedviasforaflexibleenergymodule AT donaldlupo bendingreliabilityofscreenprintedviasforaflexibleenergymodule AT mattimantysalo bendingreliabilityofscreenprintedviasforaflexibleenergymodule AT thomasmkraft bendingreliabilityofscreenprintedviasforaflexibleenergymodule
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Bending reliability of screen-printed vias for a flexible energy module

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