Bending reliability of screen-printed vias for a flexible energy module
Abstract The future of printed electronics involves advancements not only related to full system integration, but also lean process manufacturing. A critical aspect of this progress is developed in this study, which evaluates a highly flexible screen printed through-hole-via using silver micropartic...
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| Auteurs principaux: | , , , , , |
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| Format: | article |
| Langue: | EN |
| Publié: |
Nature Portfolio
2020
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| Sujets: | |
| Accès en ligne: | https://doaj.org/article/f7e11fb0e6304dd09a921b515336f25c |
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