Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion
Due to the high value of its dielectric constant, polyimide does not meet the requirements of the development of integrated circuits and high-frequency printed circuits. The development of novel low dielectric constant polyimide materials for the preparation of flexible copper clad laminates is of t...
Enregistré dans:
| Auteurs principaux: | , , , , |
|---|---|
| Format: | article |
| Langue: | EN |
| Publié: |
MDPI AG
2021
|
| Sujets: | |
| Accès en ligne: | https://doaj.org/article/f9372d632d2547e4a296e881c4f7b050 |
| Tags: |
Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
|