Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion

Due to the high value of its dielectric constant, polyimide does not meet the requirements of the development of integrated circuits and high-frequency printed circuits. The development of novel low dielectric constant polyimide materials for the preparation of flexible copper clad laminates is of t...

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Autores principales:	Panpan Zhang, Lize Zhang, Ke Zhang, Jiupeng Zhao, Yao Li
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	polyimide phase inversion dielectric constant porous films Crystallography QD901-999
Acceso en línea:	https://doaj.org/article/f9372d632d2547e4a296e881c4f7b050
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spelling	oai:doaj.org-article:f9372d632d2547e4a296e881c4f7b0502021-11-25T17:19:12ZPreparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion10.3390/cryst111113832073-4352https://doaj.org/article/f9372d632d2547e4a296e881c4f7b0502021-11-01T00:00:00Zhttps://www.mdpi.com/2073-4352/11/11/1383https://doaj.org/toc/2073-4352Due to the high value of its dielectric constant, polyimide does not meet the requirements of the development of integrated circuits and high-frequency printed circuits. The development of novel low dielectric constant polyimide materials for the preparation of flexible copper clad laminates is of theoretical and practical significance in the application of polyimide for 5G communications. In this work, different fluorinated graphene/polyamic acids (FG/PAA) were used as the precursor, and the porous polyimide film was successfully prepared by phase inversion. The dielectric constant of the porous polyimide film is relatively low, being less than 1.7. When the content of fluorinated graphene is 0.5 wt%, the overall dielectric performance of the porous film is the best, with a dielectric constant of 1.56 (10 kHz) and a characteristic breakdown field strength of 56.39 kV/mm. In addition, the mechanical properties of the film are relatively poor, with tensile strengths of 13.87 MPa (0.2 wt%), 13.61 MPa (0.5 wt%), and 6.25 MPa (1.0 wt%), respectively. Therefore, further improving the breakdown resistance and mechanical properties of the porous film is essential for the application of porous ultra-low dielectric polyimide materials.Panpan ZhangLize ZhangKe ZhangJiupeng ZhaoYao LiMDPI AGarticlepolyimidephase inversiondielectric constantporous filmsCrystallographyQD901-999ENCrystals, Vol 11, Iss 1383, p 1383 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	polyimide phase inversion dielectric constant porous films Crystallography QD901-999
spellingShingle	polyimide phase inversion dielectric constant porous films Crystallography QD901-999 Panpan Zhang Lize Zhang Ke Zhang Jiupeng Zhao Yao Li Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion
description	Due to the high value of its dielectric constant, polyimide does not meet the requirements of the development of integrated circuits and high-frequency printed circuits. The development of novel low dielectric constant polyimide materials for the preparation of flexible copper clad laminates is of theoretical and practical significance in the application of polyimide for 5G communications. In this work, different fluorinated graphene/polyamic acids (FG/PAA) were used as the precursor, and the porous polyimide film was successfully prepared by phase inversion. The dielectric constant of the porous polyimide film is relatively low, being less than 1.7. When the content of fluorinated graphene is 0.5 wt%, the overall dielectric performance of the porous film is the best, with a dielectric constant of 1.56 (10 kHz) and a characteristic breakdown field strength of 56.39 kV/mm. In addition, the mechanical properties of the film are relatively poor, with tensile strengths of 13.87 MPa (0.2 wt%), 13.61 MPa (0.5 wt%), and 6.25 MPa (1.0 wt%), respectively. Therefore, further improving the breakdown resistance and mechanical properties of the porous film is essential for the application of porous ultra-low dielectric polyimide materials.
format	article
author	Panpan Zhang Lize Zhang Ke Zhang Jiupeng Zhao Yao Li
author_facet	Panpan Zhang Lize Zhang Ke Zhang Jiupeng Zhao Yao Li
author_sort	Panpan Zhang
title	Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion
title_short	Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion
title_full	Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion
title_fullStr	Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion
title_full_unstemmed	Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion
title_sort	preparation of polyimide films with ultra-low dielectric constant by phase inversion
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/f9372d632d2547e4a296e881c4f7b050
work_keys_str_mv	AT panpanzhang preparationofpolyimidefilmswithultralowdielectricconstantbyphaseinversion AT lizezhang preparationofpolyimidefilmswithultralowdielectricconstantbyphaseinversion AT kezhang preparationofpolyimidefilmswithultralowdielectricconstantbyphaseinversion AT jiupengzhao preparationofpolyimidefilmswithultralowdielectricconstantbyphaseinversion AT yaoli preparationofpolyimidefilmswithultralowdielectricconstantbyphaseinversion
_version_	1718412568704319488

Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion

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