Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer

This study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this paper, the effects of adhesion (or lubrication) betw...

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Auteurs principaux: Jun Shimizu, Hiroshi Eda, Libo Zhou, Hidemitsu Okabe
Format: article
Langue:EN
Publié: Japanese Society of Tribologists 2008
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Accès en ligne:https://doaj.org/article/ff5b3883900f4192a7e4a44ffbec529a
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