Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer

Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer

This study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this paper, the effects of adhesion (or lubrication) betw...

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Enregistré dans:
Détails bibliographiques
Auteurs principaux: Jun Shimizu, Hiroshi Eda, Libo Zhou, Hidemitsu Okabe
Format: article
Langue:EN
Publié: Japanese Society of Tribologists 2008
Sujets:
silicon wafer
diamond abrasive
grinding
adhesion
subsurface damage
tool wear
molecular dynamics
interatomic potential
Physics
QC1-999
Engineering (General). Civil engineering (General)
TA1-2040
Mechanical engineering and machinery
TJ1-1570
Chemistry
QD1-999
Accès en ligne:https://doaj.org/article/ff5b3883900f4192a7e4a44ffbec529a
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https://doaj.org/article/ff5b3883900f4192a7e4a44ffbec529a

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