Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer

Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer

This study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this paper, the effects of adhesion (or lubrication) betw...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Jun Shimizu, Hiroshi Eda, Libo Zhou, Hidemitsu Okabe
Formato: article
Lenguaje:EN
Publicado: Japanese Society of Tribologists 2008
Materias:
silicon wafer
diamond abrasive
grinding
adhesion
subsurface damage
tool wear
molecular dynamics
interatomic potential
Physics
QC1-999
Engineering (General). Civil engineering (General)
TA1-2040
Mechanical engineering and machinery
TJ1-1570
Chemistry
QD1-999
Acceso en línea:https://doaj.org/article/ff5b3883900f4192a7e4a44ffbec529a
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!

Internet

https://doaj.org/article/ff5b3883900f4192a7e4a44ffbec529a

Ejemplares similares