Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer
This study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this paper, the effects of adhesion (or lubrication) betw...
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Japanese Society of Tribologists
2008
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oai:doaj.org-article:ff5b3883900f4192a7e4a44ffbec529a2021-11-05T09:28:53ZMolecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer1881-219810.2474/trol.3.248https://doaj.org/article/ff5b3883900f4192a7e4a44ffbec529a2008-10-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/trol/3/5/3_5_248/_pdf/-char/enhttps://doaj.org/toc/1881-2198This study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this paper, the effects of adhesion (or lubrication) between a Si wafer and a diamond abrasive on the material removal and tool wear were analyzed by means of the molecular dynamics simulation. A few simulations were performed with changing the dissociation (cohesion) energy of a Morse potential function between a pair of Si and C atoms to evaluate the influence of adhesion on the material removal process. As a result, a trend similar to the actual diamond grinding process of silicon wafer was confirmed, which suggested that the reduction in adhesion (or proper lubrication) is effective for the reduction in subsurface damages, grinding forces, grinding temperature and tool wear, but may lead to reduction in the material removal rate as well.Jun ShimizuHiroshi EdaLibo ZhouHidemitsu OkabeJapanese Society of Tribologistsarticlesilicon waferdiamond abrasivegrindingadhesionsubsurface damagetool wearmolecular dynamicsinteratomic potentialPhysicsQC1-999Engineering (General). Civil engineering (General)TA1-2040Mechanical engineering and machineryTJ1-1570ChemistryQD1-999ENTribology Online, Vol 3, Iss 5, Pp 248-253 (2008) |
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DOAJ |
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DOAJ |
| language |
EN |
| topic |
silicon wafer diamond abrasive grinding adhesion subsurface damage tool wear molecular dynamics interatomic potential Physics QC1-999 Engineering (General). Civil engineering (General) TA1-2040 Mechanical engineering and machinery TJ1-1570 Chemistry QD1-999 |
| spellingShingle |
silicon wafer diamond abrasive grinding adhesion subsurface damage tool wear molecular dynamics interatomic potential Physics QC1-999 Engineering (General). Civil engineering (General) TA1-2040 Mechanical engineering and machinery TJ1-1570 Chemistry QD1-999 Jun Shimizu Hiroshi Eda Libo Zhou Hidemitsu Okabe Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| description |
This study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this paper, the effects of adhesion (or lubrication) between a Si wafer and a diamond abrasive on the material removal and tool wear were analyzed by means of the molecular dynamics simulation. A few simulations were performed with changing the dissociation (cohesion) energy of a Morse potential function between a pair of Si and C atoms to evaluate the influence of adhesion on the material removal process. As a result, a trend similar to the actual diamond grinding process of silicon wafer was confirmed, which suggested that the reduction in adhesion (or proper lubrication) is effective for the reduction in subsurface damages, grinding forces, grinding temperature and tool wear, but may lead to reduction in the material removal rate as well. |
| format |
article |
| author |
Jun Shimizu Hiroshi Eda Libo Zhou Hidemitsu Okabe |
| author_facet |
Jun Shimizu Hiroshi Eda Libo Zhou Hidemitsu Okabe |
| author_sort |
Jun Shimizu |
| title |
Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| title_short |
Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| title_full |
Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| title_fullStr |
Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| title_full_unstemmed |
Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| title_sort |
molecular dynamics simulation of adhesion effect on material removal and tool wear in diamond grinding of silicon wafer |
| publisher |
Japanese Society of Tribologists |
| publishDate |
2008 |
| url |
https://doaj.org/article/ff5b3883900f4192a7e4a44ffbec529a |
| work_keys_str_mv |
AT junshimizu moleculardynamicssimulationofadhesioneffectonmaterialremovalandtoolwearindiamondgrindingofsiliconwafer AT hiroshieda moleculardynamicssimulationofadhesioneffectonmaterialremovalandtoolwearindiamondgrindingofsiliconwafer AT libozhou moleculardynamicssimulationofadhesioneffectonmaterialremovalandtoolwearindiamondgrindingofsiliconwafer AT hidemitsuokabe moleculardynamicssimulationofadhesioneffectonmaterialremovalandtoolwearindiamondgrindingofsiliconwafer |
| _version_ |
1718444388084875264 |