Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface

por Chun-Lung Huang, Wei-Lun Weng, Chien-Neng Liao, K. N. Tu
Publicado 2018

Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps

por Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, K. N. Tu, Chih Chen
Publicado 2021

Effect of oxidation on electromigration in 2-µm Cu redistribution lines capped with polyimide

por I-Hsin Tseng, Po-Ning Hsu, Wei-You Hsu, Dinh-Phuc Tran, Benson Tsu-Hung Lin, Chia-Cheng Chang, K.N. Tu, Chih Chen
Publicado 2021