Material-Device-Circuit Co-optimization of 2D Material based FETs for Ultra-Scaled Technology Nodes

Abstract Two-dimensional (2D) material based FETs are being considered for future technology nodes and high performance logic applications. However, a comprehensive assessment of 2D material based FETs has been lacking for high performance logic applications considering appropriate system level figu...

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Autores principales: Tarun kumar Agarwal, Bart Soree, Iuliana Radu, Praveen Raghavan, Giuseppe Iannaccone, Gianluca Fiori, Wim Dehaene, Marc Heyns
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Lenguaje:EN
Publicado: Nature Portfolio 2017
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Acceso en línea:https://doaj.org/article/3aba0caa895f420b8b71b17ac1ba4519
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spelling oai:doaj.org-article:3aba0caa895f420b8b71b17ac1ba45192021-12-02T15:06:26ZMaterial-Device-Circuit Co-optimization of 2D Material based FETs for Ultra-Scaled Technology Nodes10.1038/s41598-017-04055-32045-2322https://doaj.org/article/3aba0caa895f420b8b71b17ac1ba45192017-07-01T00:00:00Zhttps://doi.org/10.1038/s41598-017-04055-3https://doaj.org/toc/2045-2322Abstract Two-dimensional (2D) material based FETs are being considered for future technology nodes and high performance logic applications. However, a comprehensive assessment of 2D material based FETs has been lacking for high performance logic applications considering appropriate system level figure-of-merits (FOMs) e.g. delay, and energy-delay product. In this paper, we present guidelines for 2D material based FETs to meet sub-10 nm high performance logic requirements focusing on material requirement, device design, energy-delay optimization for the first time. We show the need for 2D materials with smaller effective mass in the transport direction and anisotropicity to meet the performance requirement for future technology nodes. We present novel device designs with one such 2D material (monolayer black-phosphorus) to keep Moore’s alive for the HP logic in sub-5 nm gate length regime. With these device proposals we show that below 5 nm gate lengths 2D electrostatistics arising from gate stack design becomes more of a challenge than direct source-to-drain tunneling for 2D material-based FETs. Therefore, it is challenging to meet both delay and energy-delay requirement in sub-5 nm gate length regime without scaling both supply voltage (V DD ) and effective-oxide-thickness (EOT) below 0.5 V and 0.5 nm respectively.Tarun kumar AgarwalBart SoreeIuliana RaduPraveen RaghavanGiuseppe IannacconeGianluca FioriWim DehaeneMarc HeynsNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 7, Iss 1, Pp 1-7 (2017)
institution DOAJ
collection DOAJ
language EN
topic Medicine
R
Science
Q
spellingShingle Medicine
R
Science
Q
Tarun kumar Agarwal
Bart Soree
Iuliana Radu
Praveen Raghavan
Giuseppe Iannaccone
Gianluca Fiori
Wim Dehaene
Marc Heyns
Material-Device-Circuit Co-optimization of 2D Material based FETs for Ultra-Scaled Technology Nodes
description Abstract Two-dimensional (2D) material based FETs are being considered for future technology nodes and high performance logic applications. However, a comprehensive assessment of 2D material based FETs has been lacking for high performance logic applications considering appropriate system level figure-of-merits (FOMs) e.g. delay, and energy-delay product. In this paper, we present guidelines for 2D material based FETs to meet sub-10 nm high performance logic requirements focusing on material requirement, device design, energy-delay optimization for the first time. We show the need for 2D materials with smaller effective mass in the transport direction and anisotropicity to meet the performance requirement for future technology nodes. We present novel device designs with one such 2D material (monolayer black-phosphorus) to keep Moore’s alive for the HP logic in sub-5 nm gate length regime. With these device proposals we show that below 5 nm gate lengths 2D electrostatistics arising from gate stack design becomes more of a challenge than direct source-to-drain tunneling for 2D material-based FETs. Therefore, it is challenging to meet both delay and energy-delay requirement in sub-5 nm gate length regime without scaling both supply voltage (V DD ) and effective-oxide-thickness (EOT) below 0.5 V and 0.5 nm respectively.
format article
author Tarun kumar Agarwal
Bart Soree
Iuliana Radu
Praveen Raghavan
Giuseppe Iannaccone
Gianluca Fiori
Wim Dehaene
Marc Heyns
author_facet Tarun kumar Agarwal
Bart Soree
Iuliana Radu
Praveen Raghavan
Giuseppe Iannaccone
Gianluca Fiori
Wim Dehaene
Marc Heyns
author_sort Tarun kumar Agarwal
title Material-Device-Circuit Co-optimization of 2D Material based FETs for Ultra-Scaled Technology Nodes
title_short Material-Device-Circuit Co-optimization of 2D Material based FETs for Ultra-Scaled Technology Nodes
title_full Material-Device-Circuit Co-optimization of 2D Material based FETs for Ultra-Scaled Technology Nodes
title_fullStr Material-Device-Circuit Co-optimization of 2D Material based FETs for Ultra-Scaled Technology Nodes
title_full_unstemmed Material-Device-Circuit Co-optimization of 2D Material based FETs for Ultra-Scaled Technology Nodes
title_sort material-device-circuit co-optimization of 2d material based fets for ultra-scaled technology nodes
publisher Nature Portfolio
publishDate 2017
url https://doaj.org/article/3aba0caa895f420b8b71b17ac1ba4519
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