FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers

The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based...

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Autores principales:	David Kalaš, Karel Šíma, Petr Kadlec, Radek Polanský, Radek Soukup, Jan Řeboun, Aleš Hamáček
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	3D printing filament materials dielectric parameters thermal parameters Organic chemistry QD241-441
Acceso en línea:	https://doaj.org/article/63fd3960f72f48158f3ecd1e43740196
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id	oai:doaj.org-article:63fd3960f72f48158f3ecd1e43740196
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spelling	oai:doaj.org-article:63fd3960f72f48158f3ecd1e437401962021-11-11T18:44:21ZFFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers10.3390/polym132137022073-4360https://doaj.org/article/63fd3960f72f48158f3ecd1e437401962021-10-01T00:00:00Zhttps://www.mdpi.com/2073-4360/13/21/3702https://doaj.org/toc/2073-4360The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based on polycarbonate (PC), polyethylene terephthalate glycol (PETG), and acrylonitrile butadiene styrene (ABS-T). Their overall thermal behavior, including oxidation stability, glass transition, and melting temperature, was explored using simultaneous thermal analysis (STA) and differential scanning calorimetry (DSC). Considering their intended usage in electronic applications, the dielectric strength (<i>E<sub>p</sub></i>) and surface/volume resistivity (<i>ρ<sub>s</sub></i>/<i>ρ<sub>v</sub></i>) were comprehensively tested according to IEC 60243-1 and IEC 62631-3, respectively. The values of the dielectric constant (<i>ε</i>’) and loss factor (<i>ε</i>”) were also determined by broadband dielectric spectroscopy (BDS). While, on the one hand, exceptional dielectric properties were observed for some thermoplastic elastomers, the materials based on PCs, on the other hand, stood out from the others due to their high oxidation stability and above average dielectric properties. The low-cost materials based on PETG or ABS-T did not achieve thermal properties similar to those of the other tested polymers; nevertheless, considering the very reasonable price of these polymers, the obtained dielectric properties are promising for undemanding electronic applications.David KalašKarel ŠímaPetr KadlecRadek PolanskýRadek SoukupJan ŘebounAleš HamáčekMDPI AGarticle3D printingfilament materialsdielectric parametersthermal parametersOrganic chemistryQD241-441ENPolymers, Vol 13, Iss 3702, p 3702 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	3D printing filament materials dielectric parameters thermal parameters Organic chemistry QD241-441
spellingShingle	3D printing filament materials dielectric parameters thermal parameters Organic chemistry QD241-441 David Kalaš Karel Šíma Petr Kadlec Radek Polanský Radek Soukup Jan Řeboun Aleš Hamáček FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers
description	The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based on polycarbonate (PC), polyethylene terephthalate glycol (PETG), and acrylonitrile butadiene styrene (ABS-T). Their overall thermal behavior, including oxidation stability, glass transition, and melting temperature, was explored using simultaneous thermal analysis (STA) and differential scanning calorimetry (DSC). Considering their intended usage in electronic applications, the dielectric strength (<i>E<sub>p</sub></i>) and surface/volume resistivity (<i>ρ<sub>s</sub></i>/<i>ρ<sub>v</sub></i>) were comprehensively tested according to IEC 60243-1 and IEC 62631-3, respectively. The values of the dielectric constant (<i>ε</i>’) and loss factor (<i>ε</i>”) were also determined by broadband dielectric spectroscopy (BDS). While, on the one hand, exceptional dielectric properties were observed for some thermoplastic elastomers, the materials based on PCs, on the other hand, stood out from the others due to their high oxidation stability and above average dielectric properties. The low-cost materials based on PETG or ABS-T did not achieve thermal properties similar to those of the other tested polymers; nevertheless, considering the very reasonable price of these polymers, the obtained dielectric properties are promising for undemanding electronic applications.
format	article
author	David Kalaš Karel Šíma Petr Kadlec Radek Polanský Radek Soukup Jan Řeboun Aleš Hamáček
author_facet	David Kalaš Karel Šíma Petr Kadlec Radek Polanský Radek Soukup Jan Řeboun Aleš Hamáček
author_sort	David Kalaš
title	FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers
title_short	FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers
title_full	FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers
title_fullStr	FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers
title_full_unstemmed	FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers
title_sort	fff 3d printing in electronic applications: dielectric and thermal properties of selected polymers
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/63fd3960f72f48158f3ecd1e43740196
work_keys_str_mv	AT davidkalas fff3dprintinginelectronicapplicationsdielectricandthermalpropertiesofselectedpolymers AT karelsima fff3dprintinginelectronicapplicationsdielectricandthermalpropertiesofselectedpolymers AT petrkadlec fff3dprintinginelectronicapplicationsdielectricandthermalpropertiesofselectedpolymers AT radekpolansky fff3dprintinginelectronicapplicationsdielectricandthermalpropertiesofselectedpolymers AT radeksoukup fff3dprintinginelectronicapplicationsdielectricandthermalpropertiesofselectedpolymers AT janreboun fff3dprintinginelectronicapplicationsdielectricandthermalpropertiesofselectedpolymers AT aleshamacek fff3dprintinginelectronicapplicationsdielectricandthermalpropertiesofselectedpolymers
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FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers

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