Characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure
The crack growth resistance under thermal shock loading on silicon nitride was characterized using Disc-on-Rod test which was developed by the authors. The microdamage during thermal shock fracture was monitored by acoustic emission (AE) technique. Specimens were composed of β-Si3N4 with an acicular...
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| Auteurs principaux: | , , , , |
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| Format: | article |
| Langue: | EN |
| Publié: |
The Japan Society of Mechanical Engineers
2014
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| Accès en ligne: | https://doaj.org/article/7b4cea3acdf948d398b01a6f1bbf27e8 |
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