Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation

In this work, we analysed the difference between the measurement and simulation results of thermal drift of a custom designed capacitive MEMS accelerometer. It was manufactured in X-FAB XMB10 technology together with a dedicated readout circuit in X-FAB XP018 technology. It turned out that the tempe...

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Autores principales: Mariusz Jankowski, Piotr Zając, Piotr Amrozik, Michał Szermer, Cezary Maj, Grzegorz Jabłoński, Jacek Nazdrowicz
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Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/8d4d9a375e964554b3e96831bf582f3b
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spelling oai:doaj.org-article:8d4d9a375e964554b3e96831bf582f3b2021-11-25T17:25:44ZThermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation10.3390/en142274621996-1073https://doaj.org/article/8d4d9a375e964554b3e96831bf582f3b2021-11-01T00:00:00Zhttps://www.mdpi.com/1996-1073/14/22/7462https://doaj.org/toc/1996-1073In this work, we analysed the difference between the measurement and simulation results of thermal drift of a custom designed capacitive MEMS accelerometer. It was manufactured in X-FAB XMB10 technology together with a dedicated readout circuit in X-FAB XP018 technology. It turned out that the temperature sensitivity of the sensor’s output is nonlinear and particularly strong in the negative Celsius temperature range. It was found that the temperature drift is mainly caused by the MEMS sensor and the influence of the readout circuit is minimal. Moreover, the measurements showed that this temperature dependence is the same regardless of applied acceleration. Simulation of the accelerometer’s model allowed us to estimate the contribution of post-manufacturing mismatch on the thermal drift; for our sensor, the mismatch-induced drift accounted for about 6% of total thermal drift. It is argued that the remaining 94% of the drift could be a result of the presence of residual stress in the structure after fabrication.Mariusz JankowskiPiotr ZającPiotr AmrozikMichał SzermerCezary MajGrzegorz JabłońskiJacek NazdrowiczMDPI AGarticleMEMS accelerometercapacitive sensorintegrated readout circuittemperature driftthermal measurementsTechnologyTENEnergies, Vol 14, Iss 7462, p 7462 (2021)
institution DOAJ
collection DOAJ
language EN
topic MEMS accelerometer
capacitive sensor
integrated readout circuit
temperature drift
thermal measurements
Technology
T
spellingShingle MEMS accelerometer
capacitive sensor
integrated readout circuit
temperature drift
thermal measurements
Technology
T
Mariusz Jankowski
Piotr Zając
Piotr Amrozik
Michał Szermer
Cezary Maj
Grzegorz Jabłoński
Jacek Nazdrowicz
Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation
description In this work, we analysed the difference between the measurement and simulation results of thermal drift of a custom designed capacitive MEMS accelerometer. It was manufactured in X-FAB XMB10 technology together with a dedicated readout circuit in X-FAB XP018 technology. It turned out that the temperature sensitivity of the sensor’s output is nonlinear and particularly strong in the negative Celsius temperature range. It was found that the temperature drift is mainly caused by the MEMS sensor and the influence of the readout circuit is minimal. Moreover, the measurements showed that this temperature dependence is the same regardless of applied acceleration. Simulation of the accelerometer’s model allowed us to estimate the contribution of post-manufacturing mismatch on the thermal drift; for our sensor, the mismatch-induced drift accounted for about 6% of total thermal drift. It is argued that the remaining 94% of the drift could be a result of the presence of residual stress in the structure after fabrication.
format article
author Mariusz Jankowski
Piotr Zając
Piotr Amrozik
Michał Szermer
Cezary Maj
Grzegorz Jabłoński
Jacek Nazdrowicz
author_facet Mariusz Jankowski
Piotr Zając
Piotr Amrozik
Michał Szermer
Cezary Maj
Grzegorz Jabłoński
Jacek Nazdrowicz
author_sort Mariusz Jankowski
title Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation
title_short Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation
title_full Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation
title_fullStr Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation
title_full_unstemmed Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation
title_sort thermal performance of a capacitive comb-drive mems accelerometer: measurements vs. simulation
publisher MDPI AG
publishDate 2021
url https://doaj.org/article/8d4d9a375e964554b3e96831bf582f3b
work_keys_str_mv AT mariuszjankowski thermalperformanceofacapacitivecombdrivememsaccelerometermeasurementsvssimulation
AT piotrzajac thermalperformanceofacapacitivecombdrivememsaccelerometermeasurementsvssimulation
AT piotramrozik thermalperformanceofacapacitivecombdrivememsaccelerometermeasurementsvssimulation
AT michałszermer thermalperformanceofacapacitivecombdrivememsaccelerometermeasurementsvssimulation
AT cezarymaj thermalperformanceofacapacitivecombdrivememsaccelerometermeasurementsvssimulation
AT grzegorzjabłonski thermalperformanceofacapacitivecombdrivememsaccelerometermeasurementsvssimulation
AT jaceknazdrowicz thermalperformanceofacapacitivecombdrivememsaccelerometermeasurementsvssimulation
_version_ 1718412361564422144