Analysis of sapphire- chemical mechanical polishing using digital image processing
This study investigated the contact interface behavior between a wafer and a polishing pad in sapphire- chemical mechanical polishing (CMP) for considering the improvement of the removal rate. In our previous study we clarified that the linear velocity ratio, defined as the ratio of slurry flow velo...
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| Autores principales: | , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
The Japan Society of Mechanical Engineers
2016
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/9e50b0c0687d4608b681a3d62948f445 |
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