Entanglement across separate silicon dies in a modular superconducting qubit device

Entanglement across separate silicon dies in a modular superconducting qubit device

Abstract Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primary challenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interco...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Alysson Gold, J. P. Paquette, Anna Stockklauser, Matthew J. Reagor, M. Sohaib Alam, Andrew Bestwick, Nicolas Didier, Ani Nersisyan, Feyza Oruc, Armin Razavi, Ben Scharmann, Eyob A. Sete, Biswajit Sur, Davide Venturelli, Cody James Winkleblack, Filip Wudarski, Mike Harburn, Chad Rigetti
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2021
Materias:
Physics
QC1-999
Electronic computers. Computer science
QA75.5-76.95
Acceso en línea:https://doaj.org/article/ec282379a3494434ab3a9c0f5bb2915b
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!

Internet

https://doaj.org/article/ec282379a3494434ab3a9c0f5bb2915b

Ejemplares similares