Entanglement across separate silicon dies in a modular superconducting qubit device
Abstract Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primary challenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interco...
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| Auteurs principaux: | , , , , , , , , , , , , , , , , , |
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| Format: | article |
| Langue: | EN |
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Nature Portfolio
2021
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| Accès en ligne: | https://doaj.org/article/ec282379a3494434ab3a9c0f5bb2915b |
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