Low-energy Ar+ and N+ ion beam induced chemical vapor deposition using hexamethyldisilazane for the formation of nitrogen containing SiC and carbon containing SiN films

We proposed an experimental methodology for producing films on substrates with an ion beam induced chemical vapor deposition (IBICVD) method using hexamethyldisilazane (HMDS) as a source material. In this study, both HMDS and ion beam were simultaneously injected onto a Si substrate. We selected Ar+...

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Autores principales: Satoru Yoshimura, Satoshi Sugimoto, Takae Takeuchi, Kensuke Murai, Masato Kiuchi
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Publicado: Public Library of Science (PLoS) 2021
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Acceso en línea:https://doaj.org/article/8d810019373e4833928b209f3d68ea73
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spelling oai:doaj.org-article:8d810019373e4833928b209f3d68ea732021-11-04T06:49:43ZLow-energy Ar+ and N+ ion beam induced chemical vapor deposition using hexamethyldisilazane for the formation of nitrogen containing SiC and carbon containing SiN films1932-6203https://doaj.org/article/8d810019373e4833928b209f3d68ea732021-01-01T00:00:00Zhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC8550407/?tool=EBIhttps://doaj.org/toc/1932-6203We proposed an experimental methodology for producing films on substrates with an ion beam induced chemical vapor deposition (IBICVD) method using hexamethyldisilazane (HMDS) as a source material. In this study, both HMDS and ion beam were simultaneously injected onto a Si substrate. We selected Ar+ and N+ as the ion beam. The energy of the ion beam was 101 eV. Temperature of the Si substrate was set at 540 °C. After the experiments, films were found to be deposited on the substrates. The films were then analyzed by Fourier transform infrared (FTIR) spectroscopy, stylus profilometer, X-ray diffraction, atomic force microscopy, and X-ray photoelectron spectroscopy (XPS). The FTIR and XPS results showed that silicon carbide films containing small amount of nitrogen were formed when Ar+ ions were injected in conjunction with HMDS. On the other hand, in the cases of N+ ion beam irradiation, silicon nitride films involving small amount of carbon were formed. It was noted that no film deposition was observed when HMDS alone was supplied to the substrates without any ion beam injections.Satoru YoshimuraSatoshi SugimotoTakae TakeuchiKensuke MuraiMasato KiuchiPublic Library of Science (PLoS)articleMedicineRScienceQENPLoS ONE, Vol 16, Iss 10 (2021)
institution DOAJ
collection DOAJ
language EN
topic Medicine
R
Science
Q
spellingShingle Medicine
R
Science
Q
Satoru Yoshimura
Satoshi Sugimoto
Takae Takeuchi
Kensuke Murai
Masato Kiuchi
Low-energy Ar+ and N+ ion beam induced chemical vapor deposition using hexamethyldisilazane for the formation of nitrogen containing SiC and carbon containing SiN films
description We proposed an experimental methodology for producing films on substrates with an ion beam induced chemical vapor deposition (IBICVD) method using hexamethyldisilazane (HMDS) as a source material. In this study, both HMDS and ion beam were simultaneously injected onto a Si substrate. We selected Ar+ and N+ as the ion beam. The energy of the ion beam was 101 eV. Temperature of the Si substrate was set at 540 °C. After the experiments, films were found to be deposited on the substrates. The films were then analyzed by Fourier transform infrared (FTIR) spectroscopy, stylus profilometer, X-ray diffraction, atomic force microscopy, and X-ray photoelectron spectroscopy (XPS). The FTIR and XPS results showed that silicon carbide films containing small amount of nitrogen were formed when Ar+ ions were injected in conjunction with HMDS. On the other hand, in the cases of N+ ion beam irradiation, silicon nitride films involving small amount of carbon were formed. It was noted that no film deposition was observed when HMDS alone was supplied to the substrates without any ion beam injections.
format article
author Satoru Yoshimura
Satoshi Sugimoto
Takae Takeuchi
Kensuke Murai
Masato Kiuchi
author_facet Satoru Yoshimura
Satoshi Sugimoto
Takae Takeuchi
Kensuke Murai
Masato Kiuchi
author_sort Satoru Yoshimura
title Low-energy Ar+ and N+ ion beam induced chemical vapor deposition using hexamethyldisilazane for the formation of nitrogen containing SiC and carbon containing SiN films
title_short Low-energy Ar+ and N+ ion beam induced chemical vapor deposition using hexamethyldisilazane for the formation of nitrogen containing SiC and carbon containing SiN films
title_full Low-energy Ar+ and N+ ion beam induced chemical vapor deposition using hexamethyldisilazane for the formation of nitrogen containing SiC and carbon containing SiN films
title_fullStr Low-energy Ar+ and N+ ion beam induced chemical vapor deposition using hexamethyldisilazane for the formation of nitrogen containing SiC and carbon containing SiN films
title_full_unstemmed Low-energy Ar+ and N+ ion beam induced chemical vapor deposition using hexamethyldisilazane for the formation of nitrogen containing SiC and carbon containing SiN films
title_sort low-energy ar+ and n+ ion beam induced chemical vapor deposition using hexamethyldisilazane for the formation of nitrogen containing sic and carbon containing sin films
publisher Public Library of Science (PLoS)
publishDate 2021
url https://doaj.org/article/8d810019373e4833928b209f3d68ea73
work_keys_str_mv AT satoruyoshimura lowenergyarandnionbeaminducedchemicalvapordepositionusinghexamethyldisilazanefortheformationofnitrogencontainingsicandcarboncontainingsinfilms
AT satoshisugimoto lowenergyarandnionbeaminducedchemicalvapordepositionusinghexamethyldisilazanefortheformationofnitrogencontainingsicandcarboncontainingsinfilms
AT takaetakeuchi lowenergyarandnionbeaminducedchemicalvapordepositionusinghexamethyldisilazanefortheformationofnitrogencontainingsicandcarboncontainingsinfilms
AT kensukemurai lowenergyarandnionbeaminducedchemicalvapordepositionusinghexamethyldisilazanefortheformationofnitrogencontainingsicandcarboncontainingsinfilms
AT masatokiuchi lowenergyarandnionbeaminducedchemicalvapordepositionusinghexamethyldisilazanefortheformationofnitrogencontainingsicandcarboncontainingsinfilms
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